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Si5943DU
Vishay Siliconix
Dual P-Channel 12-V (D-S) MOSFET
PRODUCT SUMMARY
FEATURES
V DS (V)
R DS(on) ( Ω )
I D (A) a
Q g (Typ.)
? Halogen-free
? TrenchFET ? Power MOSFET
- 12
0.064 at V GS = - 4.5 V
0.089 at V GS = - 2.5 V
0.120 at V GS = - 1.8 V
- 6 a
- 6 a
a
-6
6 nC
? New Thermally Enhanced PowerPAK ?
ChipFET ? Package
- Small Footprint Area
- Low On-Resistance
RoHS
COMPLIANT
PowerPAK ChipFET Dual
1
- Thin 0.8 mm Profile
APPLICATIONS
8
D 1
D 1
S 1
G 1
2
S 2
3
4
? Load Switch, PA Switch, and Charger Switch for Portable
Devices
S 1 S 2
7
6
D 2
5
D 2
G 2
Marking Code
DC XXX
Lot Tracea b ility
and Date Code
G 1
G 2
Part #
Code
Bottom V ie w
Orderin g Information: Si5943DU-T1-GE3 (Lead (P b )-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
D 1
P-Channel MOSFET
D 2
P-Channel MOSFET
Parameter
Drain-Source Voltage
Gate-Source Voltage
T C = 25 °C
Symbol
V DS
V GS
Limit
- 12
±8
- 6 a
Unit
V
Continuous Drain Current (T J = 150 °C)
Pulsed Drain Current
Continuous Source-Drain Diode Current
T C = 70 °C
T A = 25 °C
T A = 70 °C
T C = 25 °C
T A = 25 °C
T C = 25 °C
I D
I DM
I S
- 6 a
- 5 b, c
- 4 b, c
- 20
- 6.9
- 1.9 b, c
8.3
A
Maximum Power Dissipation
T C = 70 °C
T A = 25 °C
P D
5.3
2.3 b, c
W
T A = 70 °C
1.5 b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d, e
T J , T stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient b, f t ≤ 5s
Maximum Junction-to-Case (Drain) Steady State
R thJA
R thJC
45 55
12 15
°C/W
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile ( http://www.vishay.com/ppg?73257 ). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 105 °C/W.
Document Number: 73669
S-81449-Rev. B, 23-Jun-08
www.vishay.com
1
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